Please use this identifier to cite or link to this item: https://ptsldigital.ukm.my/jspui/handle/123456789/429015
Title: To increase HCD pins yield at solder mount.
Authors: NASA (Hewlett-Packard (M) Sdn. Bhd.)
Conference Name: Konvensyen QCC Kebangsaan
Keywords: HCD pins
Quality circles - Malaysia
Solder mount
Conference Date: 1995
Conference Location: Johor Bahru
Call Number: HD66.K66 1995c katsem
Publisher: NPC
Appears in Collections:Seminar Papers/ Proceedings / Kertas Kerja Seminar/ Prosiding

Files in This Item:
There are no files associated with this item.


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.