Please use this identifier to cite or link to this item:
https://ptsldigital.ukm.my/jspui/handle/123456789/587872| Title: | Temperature and Flux Effect on Contact Angles and Intermetallic Between Sn-8Zn-3Bi Lead-free Solder and Cu Substrate |
| Authors: | Ramani Mayappan Zainal Arifin Ahmad |
| Keywords: | Antaralogam fluks pateri bebas Pb Sn-Zn-Bi sudut sentuhan |
| Issue Date: | 2009 |
| News Source: | Sains Malaysiana |
| ISSN: | 0126-6039 |
| Call Number: | Siri Q1.S23 |
| Publisher: | Penerbit UKM |
| Appears in Collections: | UKM Journal Article / Artikel Jurnal UKM |
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