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https://ptsldigital.ukm.my/jspui/handle/123456789/587872Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ramani Mayappan | - |
| dc.contributor.author | Zainal Arifin Ahmad | - |
| dc.date.accessioned | 2023-11-06T09:08:48Z | - |
| dc.date.available | 2023-11-06T09:08:48Z | - |
| dc.date.issued | 2009 | - |
| dc.identifier.issn | 0126-6039 | - |
| dc.identifier.other | ukmvital:12772 | - |
| dc.identifier.uri | https://ptsldigital.ukm.my//jspui/handle/123456789/587872 | - |
| dc.language.iso | en | - |
| dc.publisher | Penerbit UKM | - |
| dc.relation.haspart | Sains Malaysiana | - |
| dc.relation.uri | http://journalarticle.ukm.my,http://www.ukm.my/jsm/ | - |
| dc.subject | Antaralogam | - |
| dc.subject | fluks | - |
| dc.subject | pateri bebas Pb | - |
| dc.subject | Sn-Zn-Bi | - |
| dc.subject | sudut sentuhan | - |
| dc.title | Temperature and Flux Effect on Contact Angles and Intermetallic Between Sn-8Zn-3Bi Lead-free Solder and Cu Substrate | - |
| dc.type | Journal Article | - |
| dc.identifier.callno | Siri Q1.S23 | - |
| Appears in Collections: | UKM Journal Article / Artikel Jurnal UKM | |
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