Please use this identifier to cite or link to this item:
https://ptsldigital.ukm.my/jspui/handle/123456789/586694| Title: | Fabrication of deep trenches in silicon wafer using deep reactive ion etching with aluminium mask |
| Authors: | Bahram Azizollah Ganji Burhanuddin Yeop Majlis |
| Keywords: | Almask deep trench deep trenches ion etching etch rate silicon structure |
| Issue Date: | 2009 |
| News Source: | Sains Malaysiana |
| ISSN: | 0126-6039 |
| Call Number: | Siri Q1.S23 |
| Publisher: | Penerbit UKM |
| Appears in Collections: | UKM Journal Article / Artikel Jurnal UKM |
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