Please use this identifier to cite or link to this item: https://ptsldigital.ukm.my/jspui/handle/123456789/434144
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dc.contributor.authorG. Srzednicki & R.H. Driscoll-
dc.contributor.authorH. Wong-
dc.date.accessioned2023-08-04T09:40:58Z-
dc.date.available2023-08-04T09:40:58Z-
dc.identifier.otherukmvital:65697-
dc.identifier.urihttps://ptsldigital.ukm.my/jspui/handle/123456789/434144-
dc.language.isoen-
dc.publisherCentral Mechanical Engineering Research Institute, Durgapur-
dc.subjectSeed quality-
dc.subjectHeat pump drying-
dc.titleThe effects of heat pump drying on seed quality-
dc.typeSeminar Papers-
dc.identifier.callnoTP363.A835 2005 kat j.2-
dc.contributor.conferencename4th Asia Pacific Drying Conference (ADC)-
dc.coverage.conferencelocationScience City, Kolkata, India-
dc.date.conferencedate2005-
Appears in Collections:Seminar Papers/ Proceedings / Kertas Kerja Seminar/ Prosiding

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