Please use this identifier to cite or link to this item:
https://ptsldigital.ukm.my/jspui/handle/123456789/432755Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ang tian Tse | - |
| dc.date.accessioned | 2023-08-04T09:04:00Z | - |
| dc.date.available | 2023-08-04T09:04:00Z | - |
| dc.identifier.other | ukmvital:63963 | - |
| dc.identifier.uri | https://ptsldigital.ukm.my/jspui/handle/123456789/432755 | - |
| dc.subject | Solder paste | - |
| dc.subject | Surface mounting technology | - |
| dc.title | Solder paste in surface mounting technology (Abstract only) | - |
| dc.type | Seminar Papers | - |
| dc.identifier.callno | QD450 .S45 1992 sem | - |
| dc.contributor.conferencename | Seminar on Physical Chemistry | - |
| dc.coverage.conferencelocation | Pulau Pinang | - |
| dc.date.conferencedate | 23-Nov-92 | - |
| Appears in Collections: | Seminar Papers/ Proceedings / Kertas Kerja Seminar/ Prosiding | |
Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.