Please use this identifier to cite or link to this item:
https://ptsldigital.ukm.my/jspui/handle/123456789/474908| Title: | Kesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan |
| Authors: | Hoh Huey Jiun |
| Keywords: | Integrated circuits Semiconductor Semiconductor wafers - Design and construction |
| Issue Date: | 2006 |
| Call Number: | TK7871.85.H648 2006 |
| Publisher: | UKM, Bangi |
| Appears in Collections: | Faculty of Engineering and Built Environment / Fakulti Kejuruteraan dan Alam Bina |
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