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Please use this identifier to cite or link to this item: https://ptsldigital.ukm.my/jspui/handle/123456789/474908
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dc.contributor.authorHoh Huey Jiun-
dc.date.accessioned2023-10-05T06:36:48Z-
dc.date.available2023-10-05T06:36:48Z-
dc.date.issued2006-
dc.identifier.otherukmvital:967-
dc.identifier.urihttps://ptsldigital.ukm.my/jspui/handle/123456789/474908-
dc.language.isomay-
dc.publisherUKM, Bangi-
dc.relationFaculty of Engineering and Built Environment / Fakulti Kejuruteraan dan Alam Bina-
dc.rightsUKM-
dc.subjectIntegrated circuits-
dc.subjectSemiconductor-
dc.subjectSemiconductor wafers - Design and construction-
dc.titleKesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan-
dc.typeTheses-
dc.identifier.callnoTK7871.85.H648 2006-
Appears in Collections:Faculty of Engineering and Built Environment / Fakulti Kejuruteraan dan Alam Bina

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