Please use this identifier to cite or link to this item: https://ptsldigital.ukm.my/jspui/handle/123456789/519127
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dc.contributor.authorAzrul Azlan Hamzah-
dc.date.accessioned2023-10-17T08:11:04Z-
dc.date.available2023-10-17T08:11:04Z-
dc.date.issued2008-
dc.identifier.otherukmvital:507-
dc.identifier.urihttps://ptsldigital.ukm.myjspui/handle/123456789/519127-
dc.language.isoeng-
dc.publisherUKM, Bangi-
dc.relationInstitute of Microengineering and Nanoelectronics / Institut Kejuruteraan Mikro dan Nanoelektronik (IMEN)-
dc.rightsUKM-
dc.subjectMicroelectromechanical systems-
dc.subjectMicroelectronic-
dc.subjectMicroelectronic packaging-
dc.titleSputtered silicon encapsulation : wafer level packaging for MEMs devices-
dc.typetheses-
dc.identifier.callnoTK7874.A9978 2008-
Appears in Collections:Institute of Microengineering and Nanoelectronics / Institut Kejuruteraan Mikro dan Nanoelektronik (IMEN)

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