Please use this identifier to cite or link to this item:
https://ptsldigital.ukm.my/jspui/handle/123456789/462900| Title: | A study of wire bonded Cu-A1 in microelectronics packaging |
| Authors: | Tan Chee Wei |
| Keywords: | Microeclectronic packaging - Technological innovations Microelectronic packaging |
| Issue Date: | 2002 |
| Call Number: | TK874.T36 2002 |
| Publisher: | UKM, Bangi |
| URI: | https://ptsldigital.ukm.my/jspui/handle/123456789/462900 |
| Appears in Collections: | Faculty of Science and Technology / Fakulti Sains dan Teknologi |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| ukmvital_1179+ABSTRACT+ABSTRACT.0.PDF Restricted Access | 5.87 MB | Adobe PDF |  View/Open |
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