Please use this identifier to cite or link to this item:
https://ptsldigital.ukm.my/jspui/handle/123456789/584710| Title: | Numerical Modeling of Cyclic Stress-strain Behavior of Sn-Pb Solder Joint During Thermal Fatigue |
| Authors: | Liew Yek Ban Mohd Nasir Tamin |
| Keywords: | cyclic stress-strain behavior electronik packaging re-flow reliability solder joint |
| Issue Date: | 2008 |
| News Source: | Jurnal Kejuruteraan |
| ISSN: | 0128-0198 |
| Call Number: | Siri TA1.J81 |
| Publisher: | Penerbit UKM |
| URI: | https://ptsldigital.ukm.my//jspui/handle/123456789/584710 |
| Appears in Collections: | UKM Journal Article / Artikel Jurnal UKM |
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