Please use this identifier to cite or link to this item: https://ptsldigital.ukm.my/jspui/handle/123456789/519127
Title: Sputtered silicon encapsulation : wafer level packaging for MEMs devices
Authors: Azrul Azlan Hamzah
Keywords: Microelectromechanical systems
Microelectronic
Microelectronic packaging
Issue Date: 2008
Call Number: TK7874.A9978 2008
Publisher: UKM, Bangi
Appears in Collections:Institute of Microengineering and Nanoelectronics / Institut Kejuruteraan Mikro dan Nanoelektronik (IMEN)

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