1. UKM Learning and Research Repository
  2. PHD Thesis / Tesis PHD
  3. Institute of Microengineering and Nanoelectronics / Institut Kejuruteraan Mikro dan Nanoelektronik (IMEN)
Please use this identifier to cite or link to this item: https://ptsldigital.ukm.my/jspui/handle/123456789/515037
Full metadata record
DC FieldValueLanguage
dc.contributor.authorMuhammad Nubli Zulkifli (P53201)
dc.date.accessioned2023-10-16T07:53:52Z-
dc.date.available2023-10-16T07:53:52Z-
dc.date.issued2014
dc.identifier.otherukmvital:77774
dc.identifier.urihttps://ptsldigital.ukm.myjspui/handle/123456789/515037-
dc.descriptionPh.D.,Tesis ini tidak ada Perakuan Tesis Sarjana / Doktor Falsafah""
dc.language.isomay
dc.publisherUKM, Bangi
dc.relationInstitut Kejuruteraan Mikro dan Nanoelektronik (IMEN) / Institute of Microengineering and Nanoelectronics
dc.rightsUKM
dc.subjectPelekatan wayar
dc.subjectPelekukan Nano
dc.subjectWire bonding (Electronic packaging)
dc.titlePencirian sambungan pelekatan wayar dengan menggunakan kaedah pelekukan nano
dc.typeTheses
dc.format.pages198
dc.identifier.callnoTK7836.M846 2014 3 tesis
dc.identifier.barcode005314(021)(PL2)
Appears in Collections:Institute of Microengineering and Nanoelectronics / Institut Kejuruteraan Mikro dan Nanoelektronik (IMEN)

Files in This Item:
File Description SizeFormat 
ukmvital_77774+SOURCE1+SOURCE1.0.PDF
  Restricted Access		581.59 kBAdobe PDFThumbnail
View/Open
Show simple item record Recommend this item


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.