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Please use this identifier to cite or link to this item: https://ptsldigital.ukm.my/jspui/handle/123456789/462900
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dc.contributor.authorTan Chee Wei
dc.date.accessioned2023-09-25T09:12:16Z-
dc.date.available2023-09-25T09:12:16Z-
dc.date.issued2002
dc.identifier.otherukmvital:1179
dc.identifier.urihttps://ptsldigital.ukm.my/jspui/handle/123456789/462900-
dc.language.isoeng
dc.publisherUKM, Bangi
dc.relationFaculty of Science and Technology / Fakulti Sains dan Teknologi
dc.rightsUKM
dc.subjectMicroeclectronic packaging - Technological innovations
dc.subjectMicroelectronic packaging
dc.titleA study of wire bonded Cu-A1 in microelectronics packaging
dc.typetheses
dc.identifier.callnoTK874.T36 2002
Appears in Collections:Faculty of Science and Technology / Fakulti Sains dan Teknologi

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