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Title:	Pencirian bahan sebatian antara logam di dalam sistem aloi pateri bebas-plumbum timah-perak-antimoni
Authors:	Wedianti Shualdi (P40832)
Supervisor:	Badariah Bais, Prof. Madya Dr.
Keywords:	Pencirian logam sistem aloi Solder and soldering
Issue Date:	13-Aug-2013
Description:	Bahan pateri merupakan salah satu elemen penting di dalam pakej elektronik kerana ianya digunakan di pelbagai peringkat binaan pakej sama ada sebagai bahan pelekatan dai, penyambungan antara pakej dengan papan litar bercetak atau sebagai bebola pateri dalam konfigurasi cip terbalik. Aplikasi bahan pateri di dalam industri pakej elektronik bermula dengan penggunaan bahan pateri berplumbum. Namun begitu, atas kesedaran tentang risiko pencemaran toksik akibat penggunaan pateri berplumbum, undang-undang penguatkuasaan larangan penggunaan bahan berplumbum dalam produk elektronik pengguna dikuatkuasakan di Kesatuan Eropah pada 2006 yang dikenali sebagai Arahan Sekatan Bahan Berbahaya (RoHS). Sejajar dengan penguatkuasaan undang-undang ini, industri pempakejan elektronik telah disarankan untuk menggantikan bahan pateri berplumbum dengan bahan pateri bebas plumbum. Antara bahan bebas plumbum yang banyak dikaji adalah dari jenis aloi pateri TimahPerak-Antimoni (Sn-Ag-Sb). Pembentukan sebatian antara logam (IMC) sangat mempengaruhi tahap keboleharapan penyambungan bahan pateri kerana sifat mekanikalnya yang rapuh dan mudah retak dan seterusnya boleh mengakibatkan penyambungan yang dikehendaki terputus. Dalam kajian ini, pencirian ke atas lapisan sebatian antara logam di antara aloi pateri bebas plumbum Sn-Ag-Sb dan substrat Kuprum dilakukan. Spesimen diambil secara rawak dari kilang pembuatan selepas menjalani proses pelekatan dai dan seterusnya menjalani proses penuaan terma pada suhu 175C sehingga 1500 jam. Pencirian terhadap perubahan mikrostruktur pada lapisan sebatian antara logam dilakukan dengan menggunakan alat mikroskop pengimbas elektron (SEM). Penentuan komposisi sebatian antara logam yang terbentuk dianalisis menggunakan tenaga serakan sinar-x (EDX). Pencirian terhadap sifat mekanikal sebatian antara logam pula dilakukan dengan menggunakan alat pengujian nano di mana pengujian lekukan nano dijalankan untuk mendapatkan data kekerasan lapisan sebatian antara logam yang terbentuk. Pemerhatian terhadap mikrostruktur bahan menunjukkan ketebalan lapisan sebatian antara logam meningkat dengan peningkatan masa penuaan terma. Namun begitu, didapati tiada kewujudan lowong Kirkendall pada lapisan sebatian antara logam walaupun telah menjalani proses penuaan terma sehingga 1500 jam. Penentuan komposisi pula menunjukkan dua jenis komposisi yang hadir pada sebatian antara logam iaitu Cu3Sn dan Cu6Sn5. Pengujian mekanikal pula mendapati kekerasan bahan semakin berkurang seiring dengan peningkatan masa penuaan terma dan ketebalan sebatian antara logam. Hasil kajian menunjukkan bahawa bahan pateri bebas plumbum Sn-Ag-Sb mempunyai potensi yang baik untuk menggantikan bahan pateri berplumbum yang mana salah satu kelebihannya ialah pengurangan kewujudan lowong Kirkendall yang merupakan penyumbang besar kepada kegagalan sesuatu penyambungan aloi pateri.,Solder material is among the most important elements in electronic packaging as it is used in various stages of packaging assembly such as die attach materials, interconnection between packages and printed circuit boards or as solder ball in flip chip configuration. The application of solder material in the electronic packaging industries started with the usage of leaded solders. However, due to the awareness of the toxicity risks from the usage of leaded solder materials, a legislation prohibiting the intentional addition of lead in the consumer electronics products came into effect in the EU in 2006 known as the Restriction of Hazardous Substances Regulation (RoHS). In line with the enforcement of this law, electronic packaging industries were recommended to replace the leaded solders with lead-free solder materials. Among the widely researched lead-free solder materials is the Tin-Silver Antimony (Sn-Ag-Sb) solder alloy. Intermetallic compound (IMC) formation strongly influences the solder joint reliability because of its brittle mechanical properties which may lead to disconnection of solder joints. In this research, characterization on the intermetallic compound formation in the Sn-Ag-Sb lead free solder alloy on Copper substrate were done. Specimens were taken at random from manufacturing plant after the die attach process and were brought into a furnace to be thermally aged at 175C until 1500 hours. The microstructural changes in the intermetallic compound layer were characterized using the Scanning Electron Microcopy (SEM). The elemental composition in the formed intermetallic compound layer were analyzed using Energy Dispersive X-Ray (EDX). The characterization on the mechanical properties of the intermetallic compound layer were performed with a Nanotest machine where the nanoindentation tests were run in order to determine the hardness of the layer. Observation on the microstructural properties showed that the thickness of the intermetallic compound layer increased with increasing thermal aging time. However, there were no signs of Kirkendall voids formation in the intermetallic compound layer even after the specimens were thermally aged until 1500 hours. The elemental analysis with EDX showed that the intermetallic compound layer consists of two different composition which were Cu3Sn and Cu6Sn5. The nanoindentation test results showed that the hardness of intermetallic compound layer decreased with increasing aging time and increased thickness of the intermetallic compound. Results showed that the Sn-Ag-Sb lead free solder alloy has the potential to replace the leaded solder materials since it can reduce the Kirkendall voids formation which is a significant contributor to solder alloy joint failure.,Master/Sarjana
Pages:	90
Call Number:	TS610.W434 2013 3 tesis
Publisher:	UKM, Bangi
Appears in Collections:	Faculty of Engineering and Built Environment / Fakulti Kejuruteraan dan Alam Bina

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