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PreviewIssue DateTitleAuthor(s)
ukmvital_122280+SOURCE1+SOURCE1.0.PDF.jpg2012-08-02An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packagesNowshad Amin, Assoc. Prof. Dr.; Wong Tzu Ling (P40763)
ukmvital_114844+SOURCE1+SOURCE1.0.PDF.jpg2011-12-30Kesan penambahan kuprum ke atas kelakuan haus gelangsar kering keluli 0.5%cu dan keluli 3%cuSyarif Junaidi Syarifuddin Djalil, Prof. Madya Dr.; Agung Iswadi (P52200)

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