Browsing by Author P40763
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| Previews | Issue Date | Tahap Akses | Title | Author(s) |
|---|---|---|---|---|
 | 2-Aug-2012 | - | An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages | Nowshad Amin, Assoc. Prof. Dr.; Wong Tzu Ling; P40763 |